RFID device and method of forming
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United States of America Patent
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May 29, 2007
Issued Date -
N/A
app pub date -
Jun 18, 2004
filing date -
Dec 31, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.
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