Forming a substrate core with embedded capacitor and structures formed thereby
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United States of America Patent
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May 29, 2007
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N/A
app pub date -
Sep 2, 2005
filing date -
Dec 30, 2004
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Abstract
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
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