Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
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United States of America Patent
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May 29, 2007
Grant Date -
Sep 25, 2003
app pub date -
Mar 19, 2002
filing date -
Mar 19, 2002
priority date (Note) -
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Abstract
Methods, systems, and mediums of controlling a semiconductor manufacturing process are described. The method comprises the steps of measuring at least one critical dimension of at least one device being fabricated on at least one of the plurality of wafers, determining at least one process parameter value on the at least one measured dimension, and controlling at least one semiconductor manufacturing tool to process the at least one of the plurality of wafers based on the at least one parameter value. A variation in the at least one critical dimension causes undesirable variations in performance of the at least one device, and at least one process condition is directed to controlling the processing performed on the plurality of wafers. The at least one manufacturing tool includes at least one of an implanter tool and an annealing tool.
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