Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
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United States of America Patent
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Jun 5, 2007
Grant Date -
Jul 27, 2006
app pub date -
Jan 27, 2005
filing date -
Jan 27, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Memory Cards containing Integrated Circuits and other electronic components (e.g. resistors) in a variety of form factors having high quality external surfaces of polycarbonate, synthetic paper (e.g. Teslin), or other suitable material (e.g. PVC) can be made through use of injection molded thermoplastic material or thermosetting material that becomes the core layer of said Memory Cards and similar devices. The object of the invention is to provide the following properties to Memory Cards: rapid production cycle, high volume manufacturing throughput, security, electronics protection, better tamper resistance, durability, and highly reliable complex electronics encapsulation, achieved through a process utilizing low temperature and low pressure.
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