Integrated circuit package
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United States of America Patent
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Jun 5, 2007
Grant Date -
Oct 2, 2003
app pub date -
Apr 2, 2002
filing date -
Apr 2, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.
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