Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
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United States of America Patent
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Jun 12, 2007
Grant Date -
Nov 11, 2004
app pub date -
Feb 6, 2004
filing date -
Feb 7, 2003
priority date (Note) -
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Abstract
A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate, second and third carrier substrates are mounted on the first carrier substrate such that ends of the second and third carrier substrates are arranged above a semiconductor chip.
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