Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
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United States of America Patent
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Jun 12, 2007
Grant Date -
Jun 29, 2006
app pub date -
Nov 29, 2005
filing date -
Dec 24, 2004
priority date (Note) -
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Abstract
A multilayered chip capacitor (MLCC) includes internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the equivalent series resistant (ESR) and equivalent series inductance (ESL). Further, the printed circuit board (PCB) having an embedded MLCC is easily manufactured.
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