Method of making a semiconductor chip assembly with a precision-formed metal pillar
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United States of America Patent
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Jun 19, 2007
Grant Date -
N/A
app pub date -
Jun 3, 2005
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, and etching the metal base to form a metal pillar with a tip adjacent to the trench.
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