Method of making a semiconductor chip assembly with an interlocked contact terminal
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 19, 2007
Grant Date -
N/A
app pub date -
Jun 3, 2005
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, etching the metal base to form a metal pillar with a tip adjacent to the trench, and providing a contact terminal that includes the pillar etch mask and is a permanent part of the assembly.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully