Methods for designing and tuning one or more packaged integrated circuits
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United States of America Patent
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Jun 26, 2007
Grant Date -
May 11, 2006
app pub date -
Dec 16, 2005
filing date -
Jul 25, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for producing and tuning a packaged integrated circuit a) incorporates into a packaged integrated circuit design, at least one tunable circuit feature; b) fabricates a packaged integrated circuit in accordance with said packaged integrated circuit design; c) identifies a trimming point on the tunable circuit feature of said packaged integrated circuit, using an x-ray inspection system; d) relates coordinates of the trimming point to coordinates of a visible reference marker; e) utilizes the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point; and f) utilizes the cutting tool to make one or more cuts into the packaged integrated circuit, until the tunable circuit feature has been acceptably modified at the trimming point.
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