Subsurface material property measurement
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United States of America Patent
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-
Jun 26, 2007
Grant Date -
May 25, 2006
app pub date -
Nov 22, 2004
filing date -
Nov 22, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Subsurface material property measurements, such as soil or chemical properties, are obtained in situ by a direct push method that includes rotating a ring bit at the end of a casing to drill through subsurface materials, lowering a measurement probe through the advanced casing, extending the lowered measurement probe through the ring bit, and advancing the extended probe through the soil at a controlled rate while gathering material property data from sensors attached to the probe. The probe may be withdrawn for drilling, and then replaced for further data gathering.
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