Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
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United States of America Patent
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Jun 26, 2007
Grant Date -
Mar 2, 2006
app pub date -
Sep 2, 2004
filing date -
Sep 2, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.
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