Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards
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United States of America Patent
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Jul 3, 2007
Grant Date -
Jan 12, 2006
app pub date -
Sep 19, 2003
filing date -
Sep 19, 2002
priority date (Note) -
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Abstract
A rigid-flexible circuit board with two rigid areas and one flexible area, with a rigid individual layer which is copper-clad on one side, with an adhesive medium and with a copper foil, the adhesive medium having recesses in the flexible area. The rigid-flexible circuit board can be produced especially easily and economically in that at least in the rigid area there is no flexible individual layer, especially no polyimide film, between the adhesive medium and the copper foil.
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