Metallized polyimide film and manufacturing method therefor
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United States of America Patent
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Jul 10, 2007
Grant Date -
Sep 29, 2005
app pub date -
Jan 26, 2005
filing date -
Feb 4, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A metallized polyimide film includes: a polyimide film; an intermediate layer formed in the polyimide film, the intermediate layer extending 20 nm or less from a surface of the polyimide film, and the intermediate layer including at least one element selected from the group consisting of Mo, Cr, Ni, and Si injected into the polyimide film; and a conductive layer that is made of copper or a copper alloy formed on the intermediate layer, wherein the amount of the at least one element injected into the intermediate layer is between 0.3 and 15 mg/m.sup.2.
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