US Patent No: 7,242,088

Number of patents in Portfolio can not be more than 2000

IC package pressure release apparatus and method

ALSO PUBLISHED AS: 20020084532

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Importance

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Abstract

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An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEL CORPORATIONSANTA CLARA, CA25515

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Neogi, Sudipto San Jose, CA 4 2
Rumer, Chris Chandler, AZ 6 7
Sur, Biswajit San Jose, CA 21 76
Tan, Boon Seng Penang, MY 4 2

Cited Art Landscape

Patent Info (Count) # Cites Year
 
CISCO SYSTEMS, INC. (1)
6,136,128 Method of making an adhesive preform lid for electronic devices 34 1999
 
FIRST INTERNATIONAL COMPUTER, INC. (1)
6,215,180 Dual-sided heat dissipating structure for integrated circuit package 62 1999
 
MICROELECTRONIC PACKAGING AMERICA, A CORPORATION OF CA (1)
5,081,327 Sealing system for hermetic microchip packages 6 1990
 
RENESAS ELECTRONICS CORPORATION (1)
6,232,652 Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof 25 1999
 
TESSERA ADVANCED TECHNOLOGIES, INC. (1)
6,410,981 Vented semiconductor device package having separate substrate, strengthening ring and cap structures 27 1998

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