US Patent No: 7,242,088
Number of patents in Portfolio can not be more than 2000
IC package pressure release apparatus and method
Stats
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Jul 10, 2007
Issued date -
Dec 29, 2000
filing date -
09/751,214
serial no -
In Force
status
Importance
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Abstract
An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 6,410,981 Vented semiconductor device package having separate substrate, strengthening ring and cap structures | 27 | 1998 | |
| 6,232,652 Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof | 24 | 1999 | |
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| 6,136,128 Method of making an adhesive preform lid for electronic devices | 30 | 1999 | |
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| 6,215,180 Dual-sided heat dissipating structure for integrated circuit package | 61 | 1999 | |
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| 5,081,327 Sealing system for hermetic microchip packages | 6 | 1990 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 10, 2015 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 10, 2019 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |