IC package pressure release apparatus and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7242088
APP PUB NO 20020084532A1
SERIAL NO

09751214

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTEL CORPORATIONSANTA CLARA, CA27847

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Neogi, Sudipto San Jose, CA 2 4
Rumer, Chris Chandler, AZ 3 16
Sur, Biswajit San Jose, CA 13 130
Tan, Boon Seng Penang, MY 2 4

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TESSERA ADVANCED TECHNOLOGIES, INC. (1)
* 6410981 Vented semiconductor device package having separate substrate, strengthening ring and cap structures 29 1998
 
FIRST INTERNATIONAL COMPUTER, INC. (1)
* 6215180 Dual-sided heat dissipating structure for integrated circuit package 82 1999
 
CISCO SYSTEMS, INC. (1)
* 6136128 Method of making an adhesive preform lid for electronic devices 37 1999
 
RENESAS ELECTRONICS CORPORATION (1)
* 6232652 Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof 27 1999
 
MICROELECTRONIC PACKAGING AMERICA, A CORPORATION OF CA (1)
5081327 Sealing system for hermetic microchip packages 6 1990
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 2006/0071,152 Semiconductor device and method for producing same 4 2005
 
INVENSENSE, INC. (1)
* 2014/0210,019 LOW-COST PACKAGE FOR INTEGRATED MEMS SENSORS 2 2013
 
NXP B.V. (1)
* 2012/0188,721 NON-METAL STIFFENER RING FOR FCBGA 0 2011
* Cited By Examiner

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