System for loading a heat sink mechanism independently of clamping load on electrical device
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United States of America Patent
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Jul 10, 2007
Grant Date -
Jul 1, 2004
app pub date -
Dec 16, 2003
filing date -
Dec 16, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A system for coupling a heat sink to an electrical device independently of a clamping member that is used to place a coupling force between the electrical device and a substrate to which the electrical device is to be electrically connected. The system includes a clamping member adapted to push the electrical device against the substrate, to assist in electrical connection between the electrical device and the substrate, the clamping member defining a through-hole leading to the electrical device. There is also a heat-conducting member in the clamping member through-hole and adapted to thermally contact the electrical device to conduct heat away from the electrical device. A heat sink is in thermal contact with the heat-conducting member, to dissipate heat from the electrical device.
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