Housing for power semiconductor modules
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United States of America Patent
Stats
-
Jul 10, 2007
Grant Date -
Jun 15, 2006
app pub date -
Dec 15, 2003
filing date -
Dec 14, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components (50) disposed on them. The housing has a cap (14) and at least one framelike housing part (12) forming the side walls thereof. This housing part (12) includes a main frame (120) and at least one locking frame (130). The main frame (120) has guides (122, 128) for receiving connection elements (30, 32). The locking frame (130) is disposed relative to the main frame (120) such that it rests at least in part on the connection tabs (310, 320) of the connection elements (30, 32), in order to prevent movemnt of the connection elements toward the substrate (40).
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