Micromechanical component having a sealed cavity and at least two dielectric layers and corresponding method for its manufacture
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United States of America Patent
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Jul 17, 2007
Grant Date -
Sep 8, 2005
app pub date -
Dec 21, 2004
filing date -
Mar 3, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A micromechanical component having a substrate, a cavity formed in the substrate, a membrane provided on the surface of the substrate, which seals the cavity, the membrane having at least two layers between which one or several piezoelectric or piezoresistive circuit trace strip(s) is/are embedded, and a corresponding manufacturing method therefor.
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