Connector for making electrical contact at semiconductor scales

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7244125
APP PUB NO 20050124181A1
SERIAL NO

10731669

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
EPIC TECHNOLOGIES, INC.SUNNYVALE, CA19
NEOCONIX, INC.SUNNYVALE, CA29

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Dirk D Mountain View, CA 15 521
Radza, Eric M San Jose, CA 3 144
Williams, John D Campbell, CA 63 757

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (3)
5532612 Methods and apparatus for test and burn-in of integrated circuit devices 132 1994
2002/0058,356 Semiconductor package and mount board, and mounting method using the same 25 2000
2002/0146,919 Micromachined springs for strain relieved electrical connections to IC chips 33 2001
 
FRAMATOME CONNECTORS INTERNATIONAL (1)
6361328 Surface-mounted low profile connector 22 2000
 
INTERCONNECT DEVICES, INC. (2)
5629837 Button contact for surface mounting an IC device to a circuit board 70 1995
6042387 Connector, connector system and method of making a connector 45 1998
 
FormFactor, Inc. (9)
6336269 Method of fabricating an interconnection element 226 1995
5772451 Sockets for electronic components and methods of connecting to electronic components 408 1995
6032356 Wafer-level test and burn-in, and semiconductor process 163 1997
6520778 Microelectronic contact structures, and methods of making same 155 1998
6029344 Composite interconnection element for microelectronic components, and method of making same 217 1998
6640432 Method of fabricating shaped springs 106 2000
6701612 Method and apparatus for shaping spring elements 89 2000
6616966 Method of making lithographic contact springs 127 2001
6920689 Method for making a socket to perform testing on integrated circuits 39 2002
 
HITACHI, LTD. (1)
4893172 Connecting structure for electronic part and method of manufacturing the same 219 1988
 
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (1)
5292558 Process for metal deposition for microelectronic interconnections 73 1991
 
ORACLE AMERICA, INC. (1)
6923656 Land grid array socket with diverse contacts 21 2003
 
WHITAKER CORPORATION, THE (2)
5257950 Filtered electrical connector 87 1992
5358411 Duplex plated epsilon compliant beam contact and interposer 43 1993
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (8)
4548451 Pinless connector interposer and method for making the same 152 1984
4998885 Elastomeric area array interposer 164 1989
5199879 Electrical assembly with flexible circuit 75 1992
5299939 Spring array connector 118 1992
5530288 Passive interposer including at least one passive electronic component 181 1994
5791911 Coaxial interconnect devices and methods of making the same 64 1996
6156484 Gray scale etching for thin flexible interposer 42 1998
6224392 Compliant high-density land grid array (LGA) connector and method of manufacture 31 1998
 
HON HAI PRECISION INDUSTRY CO., LTD. (7)
6019611 Land grid array assembly and related contact 36 1998
6146151 Method for forming an electrical connector and an electrical connector obtained by the method 41 1999
6298552 Method for making socket connector 25 2000
6293806 Electrical connector with improved terminals for electrically connecting to a circuit board 28 2000
6814587 Electrical connector with contacts having cooperating contacting portions 23 2003
6843659 Electrical connector having terminals with reinforced interference portions 34 2003
6848929 Land grid array socket with reinforcing plate 22 2003
 
ADVANTEST (SINGAPORE) PTE. LTD. (1)
6791171 Systems for testing and packaging integrated circuits 70 2002
 
GLOBALFOUNDRIES INC. (1)
6335210 Baseplate for chip burn-in and/of testing, and method thereof 29 1999
 
YOKOGAWA ELECTRIC CORPORATION (1)
6373267 Ball grid array-integrated circuit testing device 31 1998
 
MOLEX INCORPORATED (3)
5980335 Electrical terminal 40 1998
6814584 Elastomeric electrical connector 57 2002
6881070 LGA connector and terminal thereof 28 2004
 
FUJITSU LIMITED (1)
6759257 Structure and method for embedding capacitors in z-connected multi-chip modules 14 2001
 
MOTOROLA, INC. (1)
5468655 Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules 120 1994
 
JVCO. TAM HOLDING LIMITED (1)
6692263 Spring connector for electrically connecting tracks of a display screen with an electrical circuit 22 2001
 
ITT CORPORATION (1)
5509814 Socket contact for mounting in a hole of a device 43 1993
 
DELPHI TECHNOLOGIES, INC. (2)
6442039 Metallic microstructure springs and method of making same 88 1999
6402526 Microelectronic contact assembly 29 2000
 
INTEL CORPORATION (3)
5751556 Method and apparatus for reducing warpage of an assembly substrate 79 1996
6671947 Method of making an interposer 63 2001
2005/0099,193 Electronic component/interface interposer 14 2003
 
JENTEK SENSORS, INC. (1)
6995557 High resolution inductive sensor arrays for material and defect characterization of welds 28 2004
 
W. L. GORE & ASSOCIATES, INC. (1)
5896038 Method of wafer level burn-in 109 1996
 
YAZAKI CORPORATION (1)
6465748 Wiring unit 25 2001
 
NITTO DENKO CORPORATION (1)
5575662 Methods for connecting flexible circuit substrates to contact objects and structures thereof 44 1994
 
HITACHI CHEMICAL COMPANY, LTD. (1)
6133534 Wiring board for electrical tests with bumps having polymeric coating 36 1994
 
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP (1)
6627092 Method for the fabrication of electrical contacts 33 2001
 
FREESCALE SEMICONDUCTOR, INC. (2)
5593903 Method of forming contact pads for wafer level testing and burn-in of semiconductor dice 73 1996
5860585 Substrate for transferring bumps and method of use 30 1996
 
MICRON TECHNOLOGY, INC. (13)
5483741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice 289 1994
6337575 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates 26 1998
6980017 Test interconnect for bumped semiconductor components and method of fabrication 24 1999
6437591 Test interconnect for bumped semiconductor components and method of fabrication 75 1999
6208157 Method for testing semiconductor components 74 1999
6263566 Flexible semiconductor interconnect fabricated by backslide thinning 94 1999
6397460 Electrical connector 31 2000
6420789 Ball grid array chip packages having improved testing and stacking characteristics 45 2001
6622380 Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards 69 2002
6853210 Test interconnect having suspended contacts for bumped semiconductor components 25 2002
6664131 Method of making ball grid array package with deflectable interconnect 26 2002
6960924 Electrical contact 18 2003
7002362 Test system for bumped semiconductor components 19 2004
 
High Connection Density, Inc. (1)
6551112 Test and burn-in connector 98 2002
 
ADVANTEST (SINGAPORE) PTE. LTD. (1)
6815961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 68 2002
 
XEROX CORPORATION (3)
6184699 Photolithographically patterned spring contact 74 1998
6264477 Photolithographically patterned spring contact 72 2000
6392524 Photolithographically-patterned out-of-plane coil structures and method of making 72 2000
 
QLOGIC CORPORATION (1)
7009413 System and method for testing ball grid arrays 48 2003
 
TELEDYNE TECHNOLOGIES INCORPORATED (1)
6604950 Low pitch, high density connector 43 2001
 
SOCIONEXT INC. (2)
6063640 Semiconductor wafer testing method with probe pin contact 32 1998
6661247 Semiconductor testing device 30 2001
 
ELK FINANCIAL, INC. (1)
2002/0011,859 METHOD FOR FORMING CONDUCTIVE BUMPS FOR THE PURPOSE OF CONTRRUCTING A FINE PITCH TEST DEVICE 113 1998
 
GENERAL DATACOMM, INC. (1)
5366380 Spring biased tapered contact elements for electrical connectors and integrated circuit packages 91 1993
 
FUJITSU SIEMENS COMPUTERS GMBH (1)
6196852 Contact arrangement 38 1999
 
AMP Incorporated (4)
5173055 Area array connector 206 1991
5152695 Surface mount electrical connector 211 1991
5135403 Solderless spring socket for printed circuit board 43 1992
5228861 High density electrical connector system 147 1992
 
TESSERA, INC. (19)
5148266 Semiconductor chip assemblies having interposer and flexible lead 610 1990
5802699 Methods of assembling microelectronic assembly with socket for engaging bump leads 232 1994
5590460 Method of making multilayer circuit 97 1994
5632631 Microelectronic contacts with asperities and methods of making same 167 1994
5812378 Microelectronic connector for engaging bump leads 144 1995
5934914 Microelectronic contacts with asperities and methods of making same 76 1997
6205660 Method of making an electronic contact 76 1997
6083837 Fabrication of components by coining 31 1997
6200143 Low insertion force connector for microelectronic elements 101 1999
6420661 Connector element for connecting microelectronic elements 44 1999
6306752 Connection component and method of making same 24 1999
6221750 Fabrication of deformable leads of microelectronic elements 42 1999
6492251 Microelectronic joining processes with bonding material application 45 2000
6374487 Method of making a connection to a microelectronic element 40 2000
6461892 Methods of making a connection component using a removable layer 33 2001
6848173 Microelectric packages having deformed bonded leads and methods therefor 40 2001
6700072 Electrical connection with inwardly deformable contacts 24 2001
6428328 Method of making a connection to a microelectronic element 106 2001
6847101 Microelectronic package having a compliant layer with bumped protrusions 67 2002
 
ADVANTEST CORPORATION (15)
6031282 High performance integrated circuit chip package 98 1998
6297164 Method for producing contact structures 31 1998
5989994 Method for producing contact structures 37 1998
6420884 Contact structure formed by photolithography process 44 1999
6399900 Contact structure formed over a groove 28 1999
6255727 Contact structure formed by microfabrication process 46 1999
6250933 Contact structure and production method thereof 94 2000
6436802 Method of producing contact structure 35 2000
6452407 Probe contactor and production method thereof 43 2000
6472890 Method for producing a contact structure 25 2002
6612861 Contact structure and production method thereof 20 2002
6736665 Contact structure production method 35 2002
6677245 Contact structure production method 47 2002
6576485 Contact structure and production method thereof and probe contact assembly using same 44 2002
6750136 Contact structure production method 23 2003
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
5842273 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby 45 1996
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6524115 Compliant interconnect assembly 58 2000
 
TELEDYNE INDUSTRIES, INC. (1)
5967797 High density multi-pin connector with solder points 40 1997
 
ADVANCED SYSTEMS JAPAN, INC. (1)
6517362 Spiral contactor, semiconductor device inspecting apparatus and electronic part using same, and method of manufacturing the same 49 2001
 
R&D SOCKETS, INC. (2)
6409521 Multi-mode compliant connector and replaceable chip module utilizing the same 69 1999
6957963 Compliant interconnect assembly 44 2003
 
OMEGA PATENTS, L.L.C. (1)
6392534 Remote control system for a vehicle having a data communications bus and related methods 44 2000
 
SPEED TECH CORP. (1)
7021941 Flexible land grid array connector 19 2004
 
GTE Products Corporation (1)
4657336 Socket receptacle including overstress protection means for mounting electrical devices on printed circuit boards 32 1985
 
FUJIKURA LTD. (1)
6857880 Electrical connector 23 2002
 
AMPHENOL CORPORATION (1)
6730134 Interposer assembly 31 2001
 
TYCO ELECTRONICS JAPAN G.K. (1)
6976888 LGA socket contact 36 2003
 
NGK INSULATORS, LTD. (4)
6204065 Conduction assist member and manufacturing method of the same 39 1998
6293808 Contact sheet 36 1999
6474997 Contact sheet 42 2000
6719569 Contact sheet for providing an electrical connection between a plurality of electronic devices 36 2002
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2008/0303,159 Thin Silicon based substrate 1 2008
 
TE CONNECTIVITY CORPORATION (10)
* 7867032 Connector assembly having signal and coaxial contacts 1 2008
7740489 Connector assembly having a compressive coupling member 3 2008
* 7736183 Connector assembly with variable stack heights having power and signal contacts 2 2008
* 2010/0093,189 CONNECTOR ASSEMBLY HAVING SIGNAL AND COAXIAL CONTACTS 1 2008
* 2010/0093,193 CONNECTOR ASSEMBLY HAVING A COMPRESSIVE COUPLING MEMBER 3 2008
7637777 Connector assembly having a noise-reducing contact pattern 3 2008
* 7896698 Connector assembly having multiple contact arrangements 3 2009
7918683 Connector assemblies and daughter card assemblies configured to engage each other along a side interface 1 2010
8215966 Interposer connector assembly 2 2010
* 8070514 Connector assembly having multiple contact arrangements 2 2010
 
MAXIM INTEGRATED PRODUCTS, INC. (4)
8278748 Wafer-level packaged device having self-assembled resilient leads 1 2010
8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress 0 2010
8692367 Wafer-level packaged device having self-assembled resilient leads 0 2012
9159684 Wafer-level packaged device having self-assembled resilient leads 0 2014
 
ORACLE INTERNATIONAL CORPORATION (1)
8407888 Method of assembling a circuit board assembly 0 2010
 
INTEL CORPORATION (4)
7750487 Metal-metal bonding of compliant interconnect 29 2004
* 2006/0033,172 Metal-metal bonding of compliant interconnect 1 2004
7443030 Thin silicon based substrate 7 2006
7589424 Thin silicon based substrate 1 2008
 
MICRON TECHNOLOGY, INC. (2)
* 7400041 Compliant multi-composition interconnects 5 2004
* 2005/0239,275 Compliant multi-composition interconnects 10 2004
 
NEOCONIX, INC. (16)
7347698 Deep drawn electrical contacts and method for making 5 2004
* 2005/0204,538 Contact and method for making same 0 2004
7597561 Method and system for batch forming spring elements in three dimensions 7 2005
7383632 Method for fabricating a connector 10 2005
7357644 Connector having staggered contact architecture for enhanced working range 5 2005
7645147 Electrical connector having a flexible sheet and one or more conductive connectors 7 2006
8584353 Method for fabricating a contact grid array 1 2006
7354276 Interposer with compliant pins 11 2006
7587817 Method of making electrical connector on a flexible carrier 3 2006
7628617 Structure and process for a contact grid array formed in a circuitized substrate 27 2006
7371073 Contact grid array system 25 2007
* 7989945 Spring connector for making electrical contact at semiconductor scales 8 2007
7758351 Method and system for batch manufacturing of spring elements 35 2007
7621756 Contact and method for making same 9 2007
7891988 System and method for connecting flat flex cable with an integrated circuit, such as a camera module 4 2009
8641428 Electrical connector and method of making it 2 2011
 
SILICON VALLEY BANK (1)
7625220 System for connecting a camera module, or like device, using flat flex cables 3 2006
 
ADVANTEST CORPORATION (2)
* 7452214 Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads 0 2006
* 2008/0136,039 Interconnect assemblies, and methods of forming interconnects 1 2006
 
TYCO ELECTRONICS CORPORATION (2)
8113851 Connector assemblies and systems including flexible circuits 2 2010
* 2010/0303,415 CONNECTOR ASSEMBLIES AND SYSTEMS INCLUDING FLEXIBLE CIRCUITS 2 2010
 
WISPRY, INC. (2)
* 8891223 Micro-electro-mechanical system (MEMS) variable capacitors and actuation components and related methods 0 2009
* 2009/0296,309 MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VARIABLE CAPACITORS AND ACTUATION COMPONENTS AND RELATED METHODS 2 2009
* Cited By Examiner

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