US Patent No: 7,244,125

Number of patents in Portfolio can not be more than 2000

Connector for making electrical contact at semiconductor scales

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ALSO PUBLISHED AS: 20050124181
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
EPIC TECHNOLOGIES, INC.SUNNYVALE, CA15
NEOCONIX, INC.SUNNYVALE, CA28

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Dirk D Mountain View, CA 16 339
Radza, Eric M San Jose, CA 4 76
Williams, John D Albuquerque, NM 56 483

Cited Art

Patent Info (Count) # Cites Year
 
TESSERA, INC. (19)
5,148,266 Semiconductor chip assemblies having interposer and flexible lead 460 1990
5,802,699 Methods of assembling microelectronic assembly with socket for engaging bump leads 137 1994
5,590,460 Method of making multilayer circuit 89 1994
5,632,631 Microelectronic contacts with asperities and methods of making same 152 1994
5,812,378 Microelectronic connector for engaging bump leads 137 1995
5,934,914 Microelectronic contacts with asperities and methods of making same 64 1997
6,205,660 Method of making an electronic contact 62 1997
6,083,837 Fabrication of components by coining 28 1997
6,200,143 Low insertion force connector for microelectronic elements 59 1999
6,420,661 Connector element for connecting microelectronic elements 36 1999
6,306,752 Connection component and method of making same 22 1999
6,221,750 Fabrication of deformable leads of microelectronic elements 36 1999
6,492,251 Microelectronic joining processes with bonding material application 35 2000
6,374,487 Method of making a connection to a microelectronic element 36 2000
6,461,892 Methods of making a connection component using a removable layer 29 2001
6,848,173 Microelectric packages having deformed bonded leads and methods therefor 32 2001
6,700,072 Electrical connection with inwardly deformable contacts 21 2001
6,428,328 Method of making a connection to a microelectronic element 63 2001
6,847,101 Microelectronic package having a compliant layer with bumped protrusions 47 2002
 
ADVANTEST CORPORATION (15)
6,031,282 High performance integrated circuit chip package 86 1998
6,297,164 Method for producing contact structures 28 1998
5,989,994 Method for producing contact structures 33 1998
6,420,884 Contact structure formed by photolithography process 38 1999
6,399,900 Contact structure formed over a groove 26 1999
6,255,727 Contact structure formed by microfabrication process 42 1999
6,250,933 Contact structure and production method thereof 84 2000
6,436,802 Method of producing contact structure 32 2000
6,452,407 Probe contactor and production method thereof 40 2000
6,472,890 Method for producing a contact structure 20 2002
6,612,861 Contact structure and production method thereof 18 2002
6,736,665 Contact structure production method 33 2002
6,677,245 Contact structure production method 36 2002
6,576,485 Contact structure and production method thereof and probe contact assembly using same 33 2002
6,750,136 Contact structure production method 21 2003
 
MICRON TECHNOLOGY, INC. (13)
5,483,741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice 275 1994
6,337,575 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates 24 1998
6,980,017 Test interconnect for bumped semiconductor components and method of fabrication 21 1999
6,437,591 Test interconnect for bumped semiconductor components and method of fabrication 51 1999
6,208,157 Method for testing semiconductor components 69 1999
6,263,566 Flexible semiconductor interconnect fabricated by backslide thinning 54 1999
6,397,460 Electrical connector 25 2000
6,420,789 Ball grid array chip packages having improved testing and stacking characteristics 42 2001
6,622,380 Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards 54 2002
6,853,210 Test interconnect having suspended contacts for bumped semiconductor components 23 2002
6,664,131 Method of making ball grid array package with deflectable interconnect 23 2002
6,960,924 Electrical contact 16 2003
7,002,362 Test system for bumped semiconductor components 17 2004
 
FORMFACTOR, INC. (9)
6,336,269 Method of fabricating an interconnection element 156 1995
5,772,451 Sockets for electronic components and methods of connecting to electronic components 342 1995
6,032,356 Wafer-level test and burn-in, and semiconductor process 158 1997
6,520,778 Microelectronic contact structures, and methods of making same 144 1998
6,029,344 Composite interconnection element for microelectronic components, and method of making same 202 1998
6,640,432 Method of fabricating shaped springs 100 2000
6,701,612 Method and apparatus for shaping spring elements 83 2000
6,616,966 Method of making lithographic contact springs 121 2001
6,920,689 Method for making a socket to perform testing on integrated circuits 36 2002
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (9)
4,548,451 Pinless connector interposer and method for making the same 142 1984
4,998,885 Elastomeric area array interposer 116 1989
5,199,879 Electrical assembly with flexible circuit 70 1992
5,299,939 Spring array connector 96 1992
5,530,288 Passive interposer including at least one passive electronic component 139 1994
5,791,911 Coaxial interconnect devices and methods of making the same 36 1996
6,156,484 Gray scale etching for thin flexible interposer 37 1998
6,224,392 Compliant high-density land grid array (LGA) connector and method of manufacture 28 1998
6,335,210 Baseplate for chip burn-in and/of testing, and method thereof 27 1999
 
HON HAI PRECISION INDUSTRY CO., LTD. (7)
6,019,611 Land grid array assembly and related contact 33 1998
6,146,151 Method for forming an electrical connector and an electrical connector obtained by the method 35 1999
6,298,552 Method for making socket connector 23 2000
6,293,806 Electrical connector with improved terminals for electrically connecting to a circuit board 26 2000
6,814,587 Electrical connector with contacts having cooperating contacting portions 21 2003
6,843,659 Electrical connector having terminals with reinforced interference portions 31 2003
6,848,929 Land grid array socket with reinforcing plate 19 2003
 
AMP INCORPORATED (4)
5,173,055 Area array connector 186 1991
5,152,695 Surface mount electrical connector 199 1991
5,135,403 Solderless spring socket for printed circuit board 34 1992
5,228,861 High density electrical connector system 142 1992
 
NGK INSULATORS, LTD. (4)
6,204,065 Conduction assist member and manufacturing method of the same 36 1998
6,293,808 Contact sheet 34 1999
6,474,997 Contact sheet 34 2000
6,719,569 Contact sheet for providing an electrical connection between a plurality of electronic devices 30 2002
 
INTEL CORPORATION (3)
5,751,556 Method and apparatus for reducing warpage of an assembly substrate 73 1996
6,671,947 Method of making an interposer 50 2001
2005/0099,193 Electronic component/interface interposer 12 2003
 
MOLEX INCORPORATED (3)
5,980,335 Electrical terminal 31 1998
6,814,584 Elastomeric electrical connector 50 2002
6,881,070 LGA connector and terminal thereof 23 2004
 
XEROX CORPORATION (3)
6,184,699 Photolithographically patterned spring contact 68 1998
6,264,477 Photolithographically patterned spring contact 64 2000
6,392,524 Photolithographically-patterned out-of-plane coil structures and method of making 58 2000
 
ADVANTEST (SINGAPORE) PTE LTD (2)
6,815,961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 63 2002
6,791,171 Systems for testing and packaging integrated circuits 63 2002
 
DELPHI TECHNOLOGIES, INC. (2)
6,442,039 Metallic microstructure springs and method of making same 74 1999
6,402,526 Microelectronic contact assembly 26 2000
 
FREESCALE SEMICONDUCTOR, INC. (2)
5,593,903 Method of forming contact pads for wafer level testing and burn-in of semiconductor dice 70 1996
5,860,585 Substrate for transferring bumps and method of use 27 1996
 
FUJITSU SEMICONDUCTOR LIMITED (2)
6,063,640 Semiconductor wafer testing method with probe pin contact 27 1998
6,661,247 Semiconductor testing device 28 2001
 
INTERCONNECT DEVICES, INC. (2)
5,629,837 Button contact for surface mounting an IC device to a circuit board 67 1995
6,042,387 Connector, connector system and method of making a connector 43 1998
 
R&D SOCKETS, INC. (2)
6,409,521 Multi-mode compliant connector and replaceable chip module utilizing the same 57 1999
6,957,963 Compliant interconnect assembly 38 2003
 
WHITAKER CORPORATION, THE (2)
5,257,950 Filtered electrical connector 78 1992
5,358,411 Duplex plated epsilon compliant beam contact and interposer 41 1993
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6,524,115 Compliant interconnect assembly 48 2000
 
ADVANCED SYSTEMS JAPAN INC. (1)
6,517,362 Spiral contactor, semiconductor device inspecting apparatus and electronic part using same, and method of manufacturing the same 45 2001
 
AMPHENOL CORPORATION (1)
6,730,134 Interposer assembly 23 2001
 
AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. (1)
5,842,273 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby 42 1996
 
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (1)
5,292,558 Process for metal deposition for microelectronic interconnections 65 1991
 
ELK FINANCIAL, INC. (1)
2002/0011,859 METHOD FOR FORMING CONDUCTIVE BUMPS FOR THE PURPOSE OF CONTRRUCTING A FINE PITCH TEST DEVICE 104 1998
 
FRAMATOME CONNECTORS INTERNATIONAL (1)
6,361,328 Surface-mounted low profile connector 20 2000
 
FUJIKURA LTD. (1)
6,857,880 Electrical connector 20 2002
 
FUJITSU LIMITED (1)
6,759,257 Structure and method for embedding capacitors in z-connected multi-chip modules 9 2001
 
FUJITSU SIEMENS COMPUTERS GMBH (1)
6,196,852 Contact arrangement 35 1999
 
GENERAL DATACOMM, INC. (1)
5,366,380 Spring biased tapered contact elements for electrical connectors and integrated circuit packages 82 1993
 
GTE PRODUCTS CORPORATION (1)
4,657,336 Socket receptacle including overstress protection means for mounting electrical devices on printed circuit boards 26 1985
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
6,627,092 Method for the fabrication of electrical contacts 28 2001
 
HIGH CONNECTION DENSITY, INC. (1)
6,551,112 Test and burn-in connector 74 2002
 
HITACHI CHEMICAL COMPANY, LTD. (1)
6,133,534 Wiring board for electrical tests with bumps having polymeric coating 30 1994
 
HITACHI, LTD. (1)
4,893,172 Connecting structure for electronic part and method of manufacturing the same 214 1988
 
ITT CORPORATION (1)
5,509,814 Socket contact for mounting in a hole of a device 33 1993
 
JENTEK SENSORS, INC. (1)
6,995,557 High resolution inductive sensor arrays for material and defect characterization of welds 20 2004
 
JVCO. TAM HOLDING LIMITED (1)
6,692,263 Spring connector for electrically connecting tracks of a display screen with an electrical circuit 20 2001
 
MOTOROLA, INC. (1)
5,468,655 Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules 110 1994
 
NITTO DENKO CORPORATION (1)
5,575,662 Methods for connecting flexible circuit substrates to contact objects and structures thereof 41 1994
 
OMEGA PATENTS, L.L.C. (1)
6,392,534 Remote control system for a vehicle having a data communications bus and related methods 36 2000
 
QLOGIC CORPORATION (1)
7,009,413 System and method for testing ball grid arrays 16 2003
 
SPEED TECH CORP. (1)
7,021,941 Flexible land grid array connector 17 2004
 
SUN MICROSYSTEMS, INC. (1)
6,923,656 Land grid array socket with diverse contacts 17 2003
 
TELEDYNE INDUSTRIES, INC. (1)
5,967,797 High density multi-pin connector with solder points 37 1997
 
TELEDYNE TECHNOLOGIES INCORPORATED (1)
6,604,950 Low pitch, high density connector 40 2001
 
TYCO ELECTRONICS JAPAN G.K. (1)
6,976,888 LGA socket contact 32 2003
 
W. L. GORE & ASSOCIATES, INC. (1)
5,896,038 Method of wafer level burn-in 104 1996
 
YAZAKI CORPORATION (1)
6,465,748 Wiring unit 22 2001
 
YOKOGAWA ELECTRIC CORPORATION (1)
6,373,267 Ball grid array-integrated circuit testing device 25 1998
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (3)
5,532,612 Methods and apparatus for test and burn-in of integrated circuit devices 121 1994
2002/0058,356 Semiconductor package and mount board, and mounting method using the same 23 2000
2002/0146,919 Micromachined springs for strain relieved electrical connections to IC chips 29 2001

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
NEOCONIX, INC. (13)
7,347,698 Deep drawn electrical contacts and method for making 3 2004
7,597,561 Method and system for batch forming spring elements in three dimensions 2 2005
7,383,632 Method for fabricating a connector 2 2005
7,357,644 Connector having staggered contact architecture for enhanced working range 2 2005
7,645,147 Electrical connector having a flexible sheet and one or more conductive connectors 3 2006
7,354,276 Interposer with compliant pins 7 2006
7,587,817 Method of making electrical connector on a flexible carrier 2 2006
7,628,617 Structure and process for a contact grid array formed in a circuitized substrate 2 2006
7,371,073 Contact grid array system 17 2007
7,989,945 Spring connector for making electrical contact at semiconductor scales 4 2007
7,758,351 Method and system for batch manufacturing of spring elements 5 2007
7,621,756 Contact and method for making same 3 2007
7,891,988 System and method for connecting flat flex cable with an integrated circuit, such as a camera module 1 2009
 
TYCO ELECTRONICS CORPORATION (9)
7,867,032 Connector assembly having signal and coaxial contacts 1 2008
7,740,489 Connector assembly having a compressive coupling member 1 2008
7,736,183 Connector assembly with variable stack heights having power and signal contacts 0 2008
7,637,777 Connector assembly having a noise-reducing contact pattern 1 2008
7,896,698 Connector assembly having multiple contact arrangements 1 2009
7,918,683 Connector assemblies and daughter card assemblies configured to engage each other along a side interface 1 2010
8,215,966 Interposer connector assembly 0 2010
8,113,851 Connector assemblies and systems including flexible circuits 2 2010
8,070,514 Connector assembly having multiple contact arrangements 0 2010
 
INTEL CORPORATION (3)
7,750,487 Metal-metal bonding of compliant interconnect 4 2004
7,443,030 Thin silicon based substrate 2 2006
7,589,424 Thin silicon based substrate 0 2008
 
ADVANTEST (SINGAPORE) PTE LTD (1)
7,452,214 Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads 0 2006
 
MAXIM INTEGRATED PRODUCTS, INC. (1)
8,278,748 Wafer-level packaged device having self-assembled resilient leads 0 2010
 
MICRON TECHNOLOGY, INC. (1)
7,400,041 Compliant multi-composition interconnects 4 2004
 
ORACLE INTERNATIONAL CORPORATION (1)
8,407,888 Method of assembling a circuit board assembly 0 2010
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
7,625,220 System for connecting a camera module, or like device, using flat flex cables 1 2006

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jan 17, 2015
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 17, 2019
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00