Prevention of contamination on bonding pads of wafer during SMT
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United States of America Patent
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Jul 17, 2007
Grant Date -
Apr 21, 2005
app pub date -
Oct 20, 2004
filing date -
Oct 21, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device is disclosed for preventing contamination on its bonding pads during mounting an electronic component, such as surface mount device (SMD). The semiconductor device includes a semiconductor substrate, a plurality of jointing material and at least an electronic component. A plurality of first bonding pads for wire-bonding and a plurality of second bonding pads for mounting the electronic component are formed on the active surface of the substrate. The substrate includes at least a dam is formed on the active surface to separate the first bonding pads from the second bonding pads. Preferably, the dam surrounds the second bonding pads. The jointing material is disposed on the second bonding pads for bonding the electronic component. Using the dam, there is no flux or tin-lead solder flowing onto the first bonding pads during reflowing the jointing material. In an embodiment, the electronic component can be mounted on the substrate in a wafer level.
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