Semiconductor module with improved interposer structure and method for forming the same
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United States of America Patent
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Jul 17, 2007
Grant Date -
May 26, 2005
app pub date -
Nov 25, 2003
filing date -
Nov 25, 2003
priority date (Note) -
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Abstract
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.
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