Frame scale package using contact lines through the elements
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 31, 2007
Grant Date -
Dec 29, 2005
app pub date -
May 24, 2005
filing date -
Nov 1, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package for an integrated circuit contacting device which is shaped like a frame. A portion of the contacting device may be bonded to the printed circuit board, and includes leads which extend along in outer surface thereof, from an outside edge of the package to a downward facing surface of the package which faces an integrated circuit die. The package may be in dented in the shape of the die, and may also include indentations allowing a lid and/or a back portion to be located thereon. In an embodiment, a lens amounts may also be used.
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Family
International Classification(s)
Cited Art Landscape
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