Circuitry module
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United States of America Patent
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-
Jul 31, 2007
Grant Date -
Oct 6, 2005
app pub date -
Mar 11, 2005
filing date -
Sep 10, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit assembly includes multiple substrate with a regions of embedded signal processing circuitry can be connected to a region of adjustable signal processing circuitry and a cavity formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are connected to the embedded signal processing circuitry and/or to the customizable circuitry and enables the addition of a circuit element to the assembly after the bonding of the substrate layers and enables the connection of that added element to the signal processing circuitry and to the adjustable processing circuitry.
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