System and method for integrating in-situ metrology within a wafer process

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United States of America Patent

PATENT NO 7252097
APP PUB NO 20040182422A1
SERIAL NO

10606022

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Abstract

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A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATIONFREMONT CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boyd, John M Atascadero, CA 104 1753
de, Larios John M Palo Alto, CA 72 1005
Ravkin, Michael Sunnyvale, CA 72 1438
Redeker, Fred C Fremont, CA 195 5499

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