Optimized grooving structure for a CMP polishing pad
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United States of America Patent
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Aug 7, 2007
Grant Date -
Mar 2, 2006
app pub date -
Aug 25, 2004
filing date -
Aug 25, 2004
priority date (Note) -
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Abstract
A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad said grooves extend in all directions in the plane of the working surface. Such an arrangement of grooves is the optimum configuration for CMP, especially copper CMP.
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