Ejecting load monitoring method for injection molding machine
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United States of America Patent
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-
Aug 7, 2007
Grant Date -
Apr 21, 2005
app pub date -
Oct 13, 2004
filing date -
Oct 16, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A movable die is held on the front face of a movable platen. Ejector pins are incorporated in the movable die. An ejector unit that is provided with an ejector plate, actuator rods, etc., is mounted on the back of the movable platen. In ejecting a molded product from a die face, the ejector plate is advanced to cause the actuator rods to push out the ejector pins. In the ejecting load monitoring method of the invention, a plurality of monitoring sections are provided in a movement area of the ejector plate (or the actuator rod), and an upper limit value of a forward thrust load of the ejector plate is previously set for each monitoring section. An alarm is issued when the forward thrust load of the ejector plate reaches the upper limit value set for any of the monitoring sections during the ejecting operation.
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