Non-magnetic, hermetically-sealed micro device package
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United States of America Patent
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Aug 7, 2007
Grant Date -
Oct 6, 2005
app pub date -
Mar 10, 2004
filing date -
Mar 10, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions; and (c) overlaying a palladium layer on the tungsten layer.
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