Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
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United States of America Patent
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Aug 14, 2007
Grant Date -
Sep 29, 2005
app pub date -
May 6, 2005
filing date -
Jun 28, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.
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