Wafer-level fabrication method for top or side slider bond pads
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United States of America Patent
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Aug 14, 2007
Grant Date -
Aug 28, 2003
app pub date -
Oct 3, 2002
filing date -
Feb 27, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.
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