Method of making a microelectronic and/or optoelectronic circuitry sheet
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United States of America Patent
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-
Aug 21, 2007
Grant Date -
Mar 23, 2006
app pub date -
Sep 9, 2005
filing date -
Sep 10, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuitry sheet (322) comprising an electronic device layer stack (304) containing electronic devices, e.g., thin-film transistors, or portions thereof, formed by removing material from both sides of the device layer stack. The circuitry sheet may be made by an electronic/optoelectronic device manufacturing method (200) that includes the steps of forming the device layer stack on a temporary substrate (300), removing material from both sides of the device layer stack, and then attaching a permanent substrate (348) to the device layer stack. The method uses one or more resist layers (600) that may be activated simultaneously and independently to impart distinct circuit pattern images (603, 608, 612) into each of a plurality of image levels (612, 616, 620) within each resist layer, thereby obviating repetitive sequential exposure, registration and alignment steps.
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