Method and system for sealing a substrate
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United States of America Patent
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Aug 21, 2007
Grant Date -
Apr 13, 2006
app pub date -
Mar 16, 2005
filing date -
Sep 27, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
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