Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 21, 2007
Grant Date -
Aug 24, 2006
app pub date -
Feb 22, 2005
filing date -
Feb 22, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully