Prefabricated housings for microelectronic imagers
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United States of America Patent
Stats
-
Aug 28, 2007
Grant Date -
Dec 15, 2005
app pub date -
Jun 14, 2004
filing date -
Jun 14, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Microelectronic imagers with prefabricated housings and methods of packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imager can include a microelectronic die, an image sensor, and an integrated circuit operatively coupled to the integrated circuit. The microelectronic imager also includes an optic unit having an optic member. The microelectronic imager further includes a prefabricated housing having a first mounting site and a second mounting site. The die is seated within the housing at the first mounting site and the optics unit is seated within the housing at the second mounting site in a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.
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