Apparatuses and methods for planarizing a semiconductor contactor
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United States of America Patent
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Aug 28, 2007
Grant Date -
Dec 30, 2004
app pub date -
May 24, 2004
filing date -
Mar 17, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A wiring substrate can include a substrate material, which can have a first surface and a second surface. A plurality of first electrically conductive elements can be disposed on the first surface, and a plurality of second electrically conductive elements can be disposed on the second surface. Ones of the first conductive elements can be electrically connected through the substrate material to ones of the second conductive elements. A mechanism can be located in a first region, which can be a center region, of the second surface of the substrate material. The mechanism can be configured to engage a control member. First activation of the control member can apply an adjustable pulling force to the first region, and second activation of the control member can apply an adjustable pushing force to the first region. The mechanism can be or can include a threaded stud, and the control member can be or can include a threaded nut configured to engage the threaded stud.
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