Method and apparatus for testing a semiconductor structure having top-side and bottom-side connections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 28, 2007
Grant Date -
May 3, 2007
app pub date -
Oct 31, 2005
filing date -
Oct 31, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for testing a semiconductor structure having a set of top-side connections and having a set of bottom-side connections is provided. The method may include providing a device socket for connecting the set of top-side connections and the set of bottom-side connections to a tester. The method may further include providing a device hood for connecting the set of top-side connections to a respective first end of each of a plurality of interconnects in the device hood, wherein a second end of each of the plurality of interconnects in the device hood connects the set of top-side connections to the device socket. The method may further include testing the semiconductor structure using the tester. The semiconductor structure may include at least one integrated circuit to be tested.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully