Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
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United States of America Patent
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Sep 4, 2007
Grant Date -
N/A
app pub date -
Nov 12, 2002
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanically attaching the conductive trace to the chip such that the conductive trace overlaps the pad and the conductive adhesive contacts and is sandwiched between and electrically connects the conductive trace and the pad, and then removing a portion of the conductive adhesive such that the conductive adhesive still contacts and is sandwiched between and electrically connects the conductive trace and the pad and the conductive adhesive no longer electrically connects the conductive trace to a conductor external to the chip.
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