Methods and apparatus for packaging integrated circuit devices
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United States of America Patent
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Sep 4, 2007
Grant Date -
Sep 22, 2005
app pub date -
May 10, 2005
filing date -
Jun 16, 2003
priority date (Note) -
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Abstract
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.
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