Method of disassembling an image sensor package
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United States of America Patent
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Sep 11, 2007
Grant Date -
Mar 1, 2007
app pub date -
Aug 26, 2005
filing date -
Aug 26, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A method of disassembling an image sensor package, which includes a substrate and a glass layer at opposite sides. The method includes the steps of: providing a film tape adhered to the glass layer; providing a vacuuming means to suck the substrate of the image sensor package; and moving the vacuuming means away from the film tape to peel the glass layer off the image sensor package.
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