Importance

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Abstract

A process for fabricating a leadless plastic chip carrier includes selectively depositing a plurality of base layers on a first surface of a base of a leadframe strip to at least partially define a die attach pad and at least one row of contact pads. At least one further layer is selectively deposited on portions of the plurality of layers to further define at least the contact pads. The leadframe strip is then treated with a surface preparation. A semiconductor die is mounted to the die attach pad, followed by wire bonding the semiconductor die to at least the contact pads. Molding the semiconductor die, the wire bonds, the die attach pad and the contact pads on the surface of the leadframe strip, in a molding compound follows. The leadframe strip is etched to expose the contact pads and the die attach pad and the leadless plastic chip carrier is singulated from a remainder of the leadframe strip.

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First Claim