Method and integrated circuits of module packing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 18, 2007
Grant Date -
Jun 8, 2006
app pub date -
Apr 22, 2005
filing date -
Dec 3, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.
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