Microelectronic component and assembly having leads with offset portions
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United States of America Patent
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-
Sep 18, 2007
Grant Date -
Nov 2, 2006
app pub date -
May 26, 2006
filing date -
Sep 24, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.
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