Sintered rare earth magnetic alloy wafer and wafer surface growing machine
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United States of America Patent
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Sep 25, 2007
Grant Date -
Jan 19, 2006
app pub date -
Sep 16, 2005
filing date -
Nov 28, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.
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