Methods of making microelectronic packages with conductive elastomeric posts
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United States of America Patent
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Oct 2, 2007
Grant Date -
Apr 20, 2006
app pub date -
Nov 29, 2005
filing date -
Dec 12, 1996
priority date (Note) -
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Abstract
A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.
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