Capacitive micro pressure sensing member and fingerprint sensor using the same
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United States of America Patent
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-
Oct 2, 2007
Grant Date -
Mar 11, 2004
app pub date -
Aug 12, 2003
filing date -
Aug 13, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A capacitive micro pressure sensing member and a fingerprint sensor using the same. The sensing member includes a substrate, a first suspended structure, a first protrusion structure, and a second suspended structure. The first suspended structure is located above the substrate and includes a suspended thin plate and at least one compliant suspension arm connected to the suspended thin plate, which is movable so that a distance from the suspended thin plate to the substrate is changed. The first protrusion structure is arranged at a center portion of a top surface of the suspended thin plate. The second suspended structure is arranged on a top surface of the first protrusion structure with a center portion of the second suspended structure contacting the first protrusion structure. The second suspended structure covers the first suspended structure to form a sealed chamber together with the substrate.
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