Method for fabricating a film bulk acoustic resonator

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United States of America Patent

PATENT NO 7281304
APP PUB NO 20050034822A1
SERIAL NO

10827532

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Abstract

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A method for fabricating a film bulk acoustic resonator (FBAR) includes depositing a dielectric layer on a substrate, providing a sacrificial layer on part of the dielectric layer; providing a bottom electrode on part of the sacrificial layer on part of the dielectric layer; providing a piezoelectric layer on the bottom electrode; patterning a top electrode on the piezoelectric layer; and removing the sacrificial layer. The substrate may have a cavity receiving the sacrificial layer. As a result, a cantilevered resonator having an air gap between the bottom electrode and the dielectric layer may be simply fabricated.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Young-tack Suwon-si, KR 32 1018
Kim, Sang-chae Suwon-si, KR 4 72
Song, In-sang Seoul, KR 129 1263

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