Method and structure for coupling two microcircuits
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United States of America Patent
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Oct 16, 2007
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N/A
app pub date -
Feb 9, 2006
filing date -
Feb 9, 2006
priority date (Note) -
Expired
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Abstract
A system in a package (SIP) or multi-chip module (200, 300, 400) (MCM) uses an electron beam (235, 335, 435) for electrically coupling between microcircuits (230, 330, 430) and (232, 332, 432). In one embodiment, the micro-circuits (230, 430) and (232, 432) can be configured in a side-by-side configuration. In another embodiment, the micro-circuits (330) and (332) can be configured in a chip-on-chip configuration. In yet another embodiment, the electron beam (435) can include a plurality of electron beams (436) and appear as ribbon shaped between two micro-circuits (430, 432). Further, the fabrication to form the electron source (234, 334, 434) and the deflector (261, 356, 461) can be at the final metallization step of the process.
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