Back-to-back semiconductor device assemblies
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United States of America Patent
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Oct 16, 2007
Grant Date -
Feb 24, 2005
app pub date -
Sep 1, 2004
filing date -
Mar 31, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semiconductor devices may include semiconductor dice, or they may be devices that have yet to be separated from other devices carried by the same substrates.
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