Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
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United States of America Patent
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Oct 16, 2007
Grant Date -
Jan 4, 2007
app pub date -
Sep 5, 2006
filing date -
Jun 14, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Devices include at least one semiconductor die including at least one surface that is at least partially covered by a photopolymer material. The photopolymer material includes a plurality of discrete particles dispersed through a polymerized matrix. In some embodiments, the photopolymer material may cover at least a portion of each of a plurality of semiconductor dice attached to a substrate. Furthermore, the photopolymer material may cover only a portion of each of the plurality of semiconductor dice, and another photopolymer material may cover another portion of each of the plurality of semiconductor dice.
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