Illumination assembly and method of making same
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United States of America Patent
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Oct 23, 2007
Grant Date -
Jun 22, 2006
app pub date -
Dec 21, 2004
filing date -
Dec 21, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.
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