Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
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United States of America Patent
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Oct 30, 2007
Grant Date -
Jun 29, 2006
app pub date -
Jan 23, 2006
filing date -
Oct 8, 2002
priority date (Note) -
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Abstract
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the upper and lower substrates are interconnected by wire bonding; and further in which at least one of the packages includes a stacked die package, or includes an additional stacked package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, in which one or both of the upper and lower packages is a stacked die package or in which one of the packages includes an additional stacked package, and forming z-interconnects between the upper and lower substrates.
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